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Semiconductor Production Equipment Market 2019 Global Overview, Latest Technologies, Business Strategy, Key Vendors, Segments, Demands, Growth Factors, Size, Share by Forecast to 2026

Pressemeddelelse   •   Mar 17, 2020 19:24 CET

The main objective of this report is to define, describe, and forecast the global Mineral Feed market by types, application, manufacturers, and regions. The report provides detailed information about the major factors (drivers, restraints, opportunities, and industry-specific challenges) influencing the growth of the market. The report aims to strategically analyze the micromarkets with respect to individual growth trends, prospects, and contributions to the global market. The report also attempts to forecast the market size of the 5 main regions: North America, Europe, Asia Pacific (APAC), Middle East and Africa (MEA), and Latin America. It strategically profiles the key market players and comprehensively analyzes their core competencies. It also tracks and analyzes the competitive developments, such as joint ventures, mergers and acquisitions, new developments, and Research and Development (R&D) activities, in Mineral Feed market.

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The semiconductor production equipment market report provides analysis for the period 2016–2026, wherein the period from 2019 to 2026 is the forecast period and 2018 is the base year.The report covers all the major driving factors and key trending topics impacting the semiconductor production equipment market growth over the forecast period.

It also highlights the restraints and opportunities expected to influence the market during the above mentioned period. The study provides a comprehensive outlook on the semiconductor production equipment market's growth throughout the forecast period in terms of revenue (in US$ Mn) and Volume (Thousand Units), across different geographies, including Asia Pacific, South America, North America, Europe, and Middle East & Africa (MEA).

The report covers the entire market overview of the report including market dynamics such as drivers, restraints, and opportunities and trends that are predicted to leverage the existing nature and prospective status of this market.The relationship between diverse industries are explained under the ecosystem analysis.

Furthermore, the several internal and external factors affecting the semiconductor production equipment market are studied through the industry SWOT Analysis The competitive position of the semiconductor production equipment market are studied through the Porter's Five Forces Analysis. Additionally, a current indicator of diverse macro-economic factors are contextualized under key market indicators.

The semiconductor production equipment market has been provided in USD million in terms of revenue and Thousand Units in terms of volume, as well as the CAGR for the forecast period of 2019 to 2026.The semiconductor production equipment market is a global report studied on the basis of equipment type, application, dimension, and region.

Additionally, under the regional sections, the price trend and key trend analysis has been incorporated to ascertain the regional impact of the same. The incremental opportunity analysis has been figured out in order to determine the most attractive segment in the upcoming years.

The report also highlights the competitive landscape of the semiconductor production equipment market, thereby positioning all the major players according to their geographic presence and recent key developments.The comprehensive semiconductor production equipment market estimates are the result of our in-depth secondary research, primary interviews, and in-house expert panel reviews.

These market estimates have been analyzed by taking into account the impact of different political, social, economic, technological, and legal factors along with the current market dynamics affecting the semiconductor production equipment market's growth.Besides, competition matrix and market share analysis has been included under the competitive landscape to understand the top players' contribution in the semiconductor production equipment market.

Each company is studied on the basis of basic information, financial highlights of past three years, revenue highlights of regional contribution and segment contribution, product portfolio, along with the R&D investment of the past three years. Additionally, company strategy and recent developments if any are also incorporated under each company profile section.

The global semiconductor production equipment market report has profiled top players having global presence such as Applied Materials, Inc., ASML Holding N.V., Lam Research Corporation, KLA-Tencor Corporation, Advantest Corporation, Teradyne Inc., Canon Inc., Nikon Corporation, Hitachi, Ltd., Screen Holdings Co., Ltd., Tokyo Electron Limited, and Hitachi, Ltd.

Segmentation:

By Equipment Type
Wafer Processing/ Manufacturing Equipment
Surface Conditioning Equipment
Resist Processing Equipment
Thermal Processing Equipment
Etch Equipment
Others

Assembly and Packaging Equipment
Test Equipment
Others

By Dimension
2D
3D

By Application
Semiconductor Fabrication Plant/ Foundry
Semiconductor Electronics Manufacturer
Testing Home

By Geography
North America
U.S.
Canada
Rest of North America
Europe
Germany
U.K.
France
Italy
Rest of Europe
Asia Pacific
China
Japan
India
Taiwan
Korea (North & South)
Rest of Asia Pacific
Middle East & Africa (MEA)
GCC
South Africa
Rest of MEA
South America
Brazil
Rest of South America

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Chapter 1. Preface
1.1. Definitions and Overview
1.2. Segmentation and Scope
1.3. Key Research Objectives
1.4. Research Highlights

Chapter 2. Assumptions and Research Methodology

Chapter 3. Executive Summary

Chapter 4. Market Overview
4.1. Introduction
4.2. Market Dynamics
4.2.1. Drivers
4.2.2. Restraints
4.2.3. Opportunities
4.3. Industry SWOT Analysis
4.4. Porter’s Five Forces Analysis
4.5. Ecosystem Analysis
4.6. Key Trends Analysis
4.7. Key Market Indicators
4.8. Global Market Analysis and Forecast, 2016 - 2026
4.8.1. Market Value Projections (US$ Mn)
4.8.2. Market Volume Projections (Mn Units)

Chapter 5. Global Market Analysis and Forecast, by Equipment Type
5.1. Definitions
5.2. Key Findings
5.3. Global Market Size (Mn Units) (US$ Mn), by Equipment Type, 2016 - 2026
5.3.1. Wafer Processing/ Wafer Manufacturing Equipment
5.3.1.1. Surface Conditioning Equipment
5.3.1.2. Resist Processing Equipment
5.3.1.3. Thermal Processing Equipment
5.3.1.4. Etch Equipment
5.3.1.5. Others
5.3.2. Assembly and Packaging Equipment
5.3.3. Test Equipment
5.3.4. Others
5.4. Global Incremental Opportunity, by Equipment Type

Chapter 6. Global Market Analysis and Forecast, by Application
6.1. Definitions
6.2. Key Findings
6.3. Global Market Size (Mn Units) (US$ Mn), by Application, 2016 - 2026
6.3.1. Semiconductor Fabrication Plant/ Foundry
6.3.2. Semiconductor Electronics Manufacturer
6.3.3. Testing Home
6.4. Global Incremental Opportunity, by Application

Chapter 7. Global Market Analysis and Forecast, by Dimension
7.1. Definitions
7.2. Key Findings
7.3. Global Market Size (Mn Units) (US$ Mn), by Dimension, 2016 - 2026
7.3.1. 2D
7.3.2. 3D
7.4. Global Incremental Opportunity, by Dimension

Chapter 8. Global Market Analysis and Forecast, by Region
8.1. Key Findings
8.2. Global Market Size (Mn Units) (US$ Mn), by Region, 2016 - 2026
8.2.1. North America
8.2.2. Europe
8.2.3. Asia Pacific
8.2.4. Middle East and Africa
8.2.5. South America
8.3. Global Incremental Opportunity, by Region

Chapter 9. North America Market Analysis and Forecast
9.1. Key Findings
9.2. Key Trend Analysis
9.3. Price Trend Analysis
9.4. North America Market Size (Mn Units) (US$ Mn), by Equipment Type, 2016 - 2026
9.4.1. Wafer Processing/ Wafer Manufacturing Equipment
9.4.1.1. Surface Conditioning Equipment
9.4.1.2. Resist Processing Equipment
9.4.1.3. Thermal Processing Equipment
9.4.1.4. Etch Equipment
9.4.1.5. Others
9.4.2. Assembly and Packaging Equipment
9.4.3. Test Equipment
9.4.4. Others
9.5. North America Market Size (Mn Units) (US$ Mn), by Application, 2016 - 2026
9.5.1. Semiconductor Fabrication Plant/ Foundry
9.5.2. Semiconductor Electronics Manufacturer
9.5.3. Testing Home
9.6. North America Market Size (Mn Units) (US$ Mn), by Dimension, 2016 - 2026
9.6.1. 2D
9.6.2. 3D
9.7. North America Market Size (Mn Units) (US$ Mn), by Country, 2016 - 2026
9.7.1. The U.S.
9.7.2. Canada
9.7.3. Rest of North America
9.8. North America Incremental Opportunity Analysis
9.8.1. By Equipment Type
9.8.2. By Application
9.8.3. By Dimension
9.8.4. By Country

Chapter 10. Europe Market Analysis and Forecast
10.1. Key Findings
10.2. Key Trend Analysis
10.3. Price Trend Analysis
10.4. EuropeMarket Size (Mn Units) (US$ Mn), by Equipment Type, 2016 - 2026
10.4.1. Wafer Processing/ Wafer Manufacturing Equipment
10.4.1.1. Surface Conditioning Equipment
10.4.1.2. Resist Processing Equipment
10.4.1.3. Thermal Processing Equipment
10.4.1.4. Etch Equipment
10.4.1.5. Others
10.4.2. Assembly and Packaging Equipment
10.4.3. Test Equipment
10.4.4. Others
10.5. EuropeMarket Size (Mn Units) (US$ Mn), by Application, 2016 - 2026
10.5.1. Semiconductor Fabrication Plant/ Foundry
10.5.2. Semiconductor Electronics Manufacturer
10.5.3. Testing Home
10.6. EuropeMarket Size (Mn Units) (US$ Mn), by Dimension, 2016 - 2026
10.6.1. 2D
10.6.2. 3D
10.7. EuropeMarket Size (Mn Units) (US$ Mn), by Country, 2016 - 2026
10.7.1. Germany
10.7.2. France
10.7.3. Italy
10.7.4. UK
10.7.5. Rest of Europe
10.8. Europe Incremental Opportunity Analysis
10.8.1. By Equipment Type
10.8.2. By Application
10.8.3. By Dimension
10.8.4. By Country

Chapter 11. Asia Pacific Market Analysis and Forecast
11.1. Key Findings
11.2. Key Trend Analysis
11.3. Price Trend Analysis
11.4. Asia Pacific Market Size (Mn Units) (US$ Mn), by Equipment Type, 2016 - 2026
11.4.1. Wafer Processing/ Wafer Manufacturing Equipment
11.4.1.1. Surface Conditioning Equipment
11.4.1.2. Resist Processing Equipment
11.4.1.3. Thermal Processing Equipment
11.4.1.4. Etch Equipment
11.4.1.5. Others
11.4.2. Assembly and Packaging Equipment
11.4.3. Test Equipment
11.4.4. Others
11.5. Asia Pacific Market Size (Mn Units) (US$ Mn), by Application, 2016 - 2026
11.5.1. Semiconductor Fabrication Plant/ Foundry
11.5.2. Semiconductor Electronics Manufacturer
11.5.3. Testing Home
11.6. Asia Pacific Market Size (Mn Units) (US$ Mn), by Dimension, 2016 - 2026
11.6.1. 2D
11.6.2. 3D
11.7. Asia Pacific Market Size (Mn Units) (US$ Mn), by Country, 2016 - 2026
11.7.1. China
11.7.2. India
11.7.3. Japan
11.7.4. Rest of Asia Pacific
11.8. Asia Pacific Incremental Opportunity Analysis
11.8.1. By Equipment Type
11.8.2. By Application
11.8.3. By Dimension
11.8.4. By Country

Chapter 12. Middle East & AfricaMarket Analysis and Forecast
12.1. Key Findings
12.2. Key Trend Analysis
12.3. Price Trend Analysis
12.4. Middle East & Africa Market Size (Mn Units) (US$ Mn), by Equipment Type, 2016 - 2026
12.4.1. Wafer Processing/ Wafer Manufacturing Equipment
12.4.1.1. Surface Conditioning Equipment
12.4.1.2. Resist Processing Equipment
12.4.1.3. Thermal Processing Equipment
12.4.1.4. Etch Equipment
12.4.1.5. Others
12.4.2. Assembly and Packaging Equipment
12.4.3. Test Equipment
12.4.4. Others
12.5. Middle East & Africa Market Size (Mn Units) (US$ Mn), by Application, 2016 - 2026
12.5.1. Semiconductor Fabrication Plant/ Foundry
12.5.2. Semiconductor Electronics Manufacturer
12.5.3. Testing Home
12.6. Middle East & Africa Market Size (Mn Units) (US$ Mn), by Dimension, 2016 - 2026
12.6.1. 2D
12.6.2. 3D
12.7. Middle East & AfricaMarket Size (Mn Units) (US$ Mn), by Country, 2016 - 2026
12.7.1. GCC
12.7.2. South Africa
12.7.3. Rest of Middle East & Africa
12.8. Middle East & Africa Incremental Opportunity Analysis
12.8.1. By Equipment Type
12.8.2. By Application
12.8.3. By Dimension
12.8.4. By Country

Chapter 13. South AmericaMarket Analysis and Forecast
13.1. Key Findings
13.2. Key Trend Analysis
13.3. Price Trend Analysis
13.4. South AmericaMarket Size (Mn Units) (US$ Mn), by Equipment Type, 2016 - 2026
13.4.1. Wafer Processing/ Wafer Manufacturing Equipment
13.4.1.1. Surface Conditioning Equipment
13.4.1.2. Resist Processing Equipment
13.4.1.3. Thermal Processing Equipment
13.4.1.4. Etch Equipment
13.4.1.5. Others
13.4.2. Assembly and Packaging Equipment
13.4.3. Test Equipment
13.4.4. Others
13.5. South AmericaMarket Size (Mn Units) (US$ Mn), by Application, 2016 - 2026
13.5.1. Semiconductor Fabrication Plant/ Foundry
13.5.2. Semiconductor Electronics Manufacturer
13.5.3. Testing Home
13.6. South AmericaMarket Size (Mn Units) (US$ Mn), by Dimension, 2016 - 2026
13.6.1. 2D
13.6.2. 3D
13.7. South America Market Size (Mn Units) (US$ Mn), by Country, 2016 - 2026
13.7.1. Brazil
13.7.2. Rest of South America
13.8. South America Incremental Opportunity Analysis
13.8.1. By Equipment Type
13.8.2. By Application
13.8.3. By Dimension
13.8.4. By Country

Chapter 14. Competition Landscape
14.1. Competition Matrix
14.2. Market Share Analysis (Value, %), by Manufacturer, 2017
14.3. Company Profiles
14.3.1. Applied Materials, Inc.
14.3.1.1. Company Overview
14.3.1.2. Revenue Highlights
14.3.1.3. Segment Highlights
14.3.1.4. R&D Investments
14.3.1.5. Product Portfolio
14.3.1.6. Business Strategies / Recent Developments
14.3.2. Tokyo Electron Limited
14.3.2.1. Company Overview
14.3.2.2. Revenue Highlights
14.3.2.3. Segment Highlights
14.3.2.4. R&D Investments
14.3.2.5. Product Portfolio
14.3.2.6. Business Strategies / Recent Developments
14.3.3. ASML Holding N.V.
14.3.3.1. Company Overview
14.3.3.2. Revenue Highlights
14.3.3.3. Segment Highlights
14.3.3.4. R&D Investments
14.3.3.5. Product Portfolio
14.3.3.6. Business Strategies / Recent Developments
14.3.4. KLA-Tencor Corporation
14.3.4.1. Company Overview
14.3.4.2. Revenue Highlights
14.3.4.3. Segment Highlights
14.3.4.4. R&D Investments
14.3.4.5. Product Portfolio
14.3.4.6. Business Strategies / Recent Developments
14.3.5. Advantest Corporation
14.3.5.1. Company Overview
14.3.5.2. Revenue Highlights
14.3.5.3. Segment Highlights
14.3.5.4. R&D Investments
14.3.5.5. Product Portfolio
14.3.5.6. Business Strategies / Recent Developments
14.3.6. Nikon Corporation
14.3.6.1. Company Overview
14.3.6.2. Revenue Highlights
14.3.6.3. Segment Highlights
14.3.6.4. R&D Investments
14.3.6.5. Product Portfolio
14.3.6.6. Business Strategies / Recent Developments
14.3.7. Lam Research Corporation
14.3.7.1. Company Overview
14.3.7.2. Revenue Highlights
14.3.7.3. Segment Highlights
14.3.7.4. R&D Investments
14.3.7.5. Product Portfolio
14.3.7.6. Business Strategies / Recent Developments
14.3.8. Hitachi, Ltd.
14.3.8.1. Company Overview
14.3.8.2. Revenue Highlights
14.3.8.3. Segment Highlights
14.3.8.4. R&D Investments
14.3.8.5. Product Portfolio
14.3.8.6. Business Strategies / Recent Developments
14.3.9. Canon Inc.
14.3.9.1. Company Overview
14.3.9.2. Revenue Highlights
14.3.9.3. Segment Highlights
14.3.9.4. R&D Investments
14.3.9.5. Product Portfolio
14.3.9.6. Business Strategies / Recent Developments
14.3.10. Teradyne Inc.
14.3.10.1. Company Overview
14.3.10.2. Revenue Highlights
14.3.10.3. Segment Highlights
14.3.10.4. R&D Investments
14.3.10.5. Product Portfolio
14.3.10.6. Business Strategies / Recent Developments
14.3.11. Screen Holdings Co., Ltd.
14.3.11.1. Company Overview
14.3.11.2. Revenue Highlights
14.3.11.3. Segment Highlights
14.3.11.4. R&D Investments
14.3.11.5. Product Portfolio
14.3.11.6. Business Strategies / Recent Developments
14.3.12. Tokyo Seimitsu Co., Ltd.
14.3.12.1. Company Overview
14.3.12.2. Revenue Highlights
14.3.12.3. Segment Highlights
14.3.12.4. R&D Investments
14.3.12.5. Product Portfolio
14.3.12.6. Business Strategies / Recent Developments

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