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Global IC Package Substrate Sales Market 2017 By Industry Analysis, Size, Share, Growth, Trends and Forecast 2022- Global QYResearch

Press Release   •   Feb 13, 2017 12:56 IST

This report studies sales (consumption) of Global IC Package Substrate Market 2017, especially in United States, China, Europe and Japan, focuses on top players in these regions/countries, with sales, price, revenue and market share for each player in these regions, covering

Honeywell ACI
IBM
Unimicron
Multek
AT&S
Aspocomp
JCI(MGC)
Hitachi?Cable
Ibiden
Samsung
Shinko

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Market Segment by Regions, this report splits Global into several key Regions, with sales (consumption), revenue, market share and growth rate of IC Package Substrate in these regions, from 2011 to 2021 (forecast), like
United States
China
Europe
Japan
Southeast Asia
India
Split by product Types, with sales, revenue, price and gross margin, market share and growth rate of each type, can be divided into
Ball Grid Array(BGA)
Chip Scale Package/Chip Size Package(CSP)
Flip Chip(FC)
Split by applications, this report focuses on sales, market share and growth rate of IC Package Substrate in each application, can be divided into
Mobile Telephone
PC
Camera
Others

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Table of Contents

Global IC Package Substrate Sales Market Report 2017
1 IC Package Substrate Overview
1.1 Product Overview and Scope of IC Package Substrate
1.2 Classification of IC Package Substrate
1.2.1 Ball Grid Array(BGA)
1.2.2 Chip Scale Package/Chip Size Package(CSP)
1.2.3 Flip Chip(FC)
1.3 Application of IC Package Substrate
1.3.1 Mobile Telephone
1.3.2 PC
1.3.3 Camera
1.3.4 Others
1.4 IC Package Substrate Market by Regions
1.4.1 United States Status and Prospect (2012-2022)
1.4.2 China Status and Prospect (2012-2022)
1.4.3 Europe Status and Prospect (2012-2022)
1.4.4 Japan Status and Prospect (2012-2022)
1.4.5 Southeast Asia Status and Prospect (2012-2022)
1.4.6 India Status and Prospect (2012-2022)
1.5 Global Market Size (Value and Volume) of IC Package Substrate (2012-2022)
1.5.1 Global IC Package Substrate Sales and Growth Rate (2012-2022)
1.5.2 Global IC Package Substrate Revenue and Growth Rate (2012-2022)

2 Global IC Package Substrate Competition by Manufacturers, Type and Application
2.1 Global IC Package Substrate Market Competition by Manufacturers
2.1.1 Global IC Package Substrate Sales and Market Share of Key Manufacturers (2012-2017)
2.1.2 Global IC Package Substrate Revenue and Share by Manufacturers (2012-2017)
2.2 Global IC Package Substrate (Volume and Value) by Type
2.2.1 Global IC Package Substrate Sales and Market Share by Type (2012-2017)
2.2.2 Global IC Package Substrate Revenue and Market Share by Type (2012-2017)
2.3 Global IC Package Substrate (Volume and Value) by Regions
2.3.1 Global IC Package Substrate Sales and Market Share by Regions (2012-2017)
2.3.2 Global IC Package Substrate Revenue and Market Share by Regions (2012-2017)
2.4 Global IC Package Substrate (Volume) by Application

3 United States IC Package Substrate (Volume, Value and Sales Price)
3.1 United States IC Package Substrate Sales and Value (2012-2017)
3.1.1 United States IC Package Substrate Sales and Growth Rate (2012-2017)
3.1.2 United States IC Package Substrate Revenue and Growth Rate (2012-2017)
3.1.3 United States IC Package Substrate Sales Price Trend (2012-2017)
3.2 United States IC Package Substrate Sales and Market Share by Manufacturers
3.3 United States IC Package Substrate Sales and Market Share by Type
3.4 United States IC Package Substrate Sales and Market Share by Application

4 China IC Package Substrate (Volume, Value and Sales Price)
4.1 China IC Package Substrate Sales and Value (2012-2017)
4.1.1 China IC Package Substrate Sales and Growth Rate (2012-2017)
4.1.2 China IC Package Substrate Revenue and Growth Rate (2012-2017)
4.1.3 China IC Package Substrate Sales Price Trend (2012-2017)
4.2 China IC Package Substrate Sales and Market Share by Manufacturers
4.3 China IC Package Substrate Sales and Market Share by Type
4.4 China IC Package Substrate Sales and Market Share by Application

5 Europe IC Package Substrate (Volume, Value and Sales Price)
5.1 Europe IC Package Substrate Sales and Value (2012-2017)
5.1.1 Europe IC Package Substrate Sales and Growth Rate (2012-2017)
5.1.2 Europe IC Package Substrate Revenue and Growth Rate (2012-2017)
5.1.3 Europe IC Package Substrate Sales Price Trend (2012-2017)
5.2 Europe IC Package Substrate Sales and Market Share by Manufacturers
5.3 Europe IC Package Substrate Sales and Market Share by Type
5.4 Europe IC Package Substrate Sales and Market Share by Application

6 Japan IC Package Substrate (Volume, Value and Sales Price)
6.1 Japan IC Package Substrate Sales and Value (2012-2017)
6.1.1 Japan IC Package Substrate Sales and Growth Rate (2012-2017)
6.1.2 Japan IC Package Substrate Revenue and Growth Rate (2012-2017)
6.1.3 Japan IC Package Substrate Sales Price Trend (2012-2017)
6.2 Japan IC Package Substrate Sales and Market Share by Manufacturers
6.3 Japan IC Package Substrate Sales and Market Share by Type
6.4 Japan IC Package Substrate Sales and Market Share by Application
7 Southeast Asia IC Package Substrate (Volume, Value and Sales Price)
7.1 Southeast Asia IC Package Substrate Sales and Value (2012-2017)
7.1.1 Southeast Asia IC Package Substrate Sales and Growth Rate (2012-2017)
7.1.2 Southeast Asia IC Package Substrate Revenue and Growth Rate (2012-2017)
7.1.3 Southeast Asia IC Package Substrate Sales Price Trend (2012-2017)
7.2 Southeast Asia IC Package Substrate Sales and Market Share by Manufacturers
7.3 Southeast Asia IC Package Substrate Sales and Market Share by Type
7.4 Southeast Asia IC Package Substrate Sales and Market Share by Application
8 India IC Package Substrate (Volume, Value and Sales Price)
8.1 India IC Package Substrate Sales and Value (2012-2017)
8.1.1 India IC Package Substrate Sales and Growth Rate (2012-2017)
8.1.2 India IC Package Substrate Revenue and Growth Rate (2012-2017)
8.1.3 India IC Package Substrate Sales Price Trend (2012-2017)
8.2 India IC Package Substrate Sales and Market Share by Manufacturers
8.3 India IC Package Substrate Sales and Market Share by Type
8.4 India IC Package Substrate Sales and Market Share by Application

9 Global IC Package Substrate Manufacturers Analysis
9.1 Honeywell ACI
9.1.1 Company Basic Information, Manufacturing Base and Competitors
9.1.2 IC Package Substrate Product Type, Application and Specification
9.1.2.1 Ball Grid Array(BGA)
9.1.2.2 Chip Scale Package/Chip Size Package(CSP)
9.1.3 Honeywell ACI IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.1.4 Main Business/Business Overview
9.2 IBM
9.2.1 Company Basic Information, Manufacturing Base and Competitors
9.2.2 IC Package Substrate Product Type, Application and Specification
9.2.2.1 Ball Grid Array(BGA)
9.2.2.2 Chip Scale Package/Chip Size Package(CSP)
9.2.3 IBM IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.2.4 Main Business/Business Overview
9.3 Unimicron
9.3.1 Company Basic Information, Manufacturing Base and Competitors
9.3.2 IC Package Substrate Product Type, Application and Specification
9.3.2.1 Ball Grid Array(BGA)
9.3.2.2 Chip Scale Package/Chip Size Package(CSP)
9.3.3 Unimicron IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.3.4 Main Business/Business Overview
9.4 Multek
9.4.1 Company Basic Information, Manufacturing Base and Competitors
9.4.2 IC Package Substrate Product Type, Application and Specification
9.4.2.1 Ball Grid Array(BGA)
9.4.2.2 Chip Scale Package/Chip Size Package(CSP)
9.4.3 Multek IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.4.4 Main Business/Business Overview
9.5 AT&S
9.5.1 Company Basic Information, Manufacturing Base and Competitors
9.5.2 IC Package Substrate Product Type, Application and Specification
9.5.2.1 Ball Grid Array(BGA)
9.5.2.2 Chip Scale Package/Chip Size Package(CSP)
9.5.3 AT&S IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.5.4 Main Business/Business Overview
9.6 Aspocomp
9.6.1 Company Basic Information, Manufacturing Base and Competitors
9.6.2 IC Package Substrate Product Type, Application and Specification
9.6.2.1 Ball Grid Array(BGA)
9.6.2.2 Chip Scale Package/Chip Size Package(CSP)
9.6.3 Aspocomp IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.6.4 Main Business/Business Overview
9.7 JCI(MGC)
9.7.1 Company Basic Information, Manufacturing Base and Competitors
9.7.2 IC Package Substrate Product Type, Application and Specification
9.7.2.1 Ball Grid Array(BGA)
9.7.2.2 Chip Scale Package/Chip Size Package(CSP)
9.7.3 JCI(MGC) IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.7.4 Main Business/Business Overview
9.8 Hitachi?Cable
9.8.1 Company Basic Information, Manufacturing Base and Competitors
9.8.2 IC Package Substrate Product Type, Application and Specification
9.8.2.1 Ball Grid Array(BGA)
9.8.2.2 Chip Scale Package/Chip Size Package(CSP)
9.8.3 Hitachi?Cable IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.8.4 Main Business/Business Overview
9.9 Ibiden
9.9.1 Company Basic Information, Manufacturing Base and Competitors
9.9.2 IC Package Substrate Product Type, Application and Specification
9.9.2.1 Ball Grid Array(BGA)
9.9.2.2 Chip Scale Package/Chip Size Package(CSP)
9.9.3 Ibiden IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.9.4 Main Business/Business Overview
9.10 Samsung
9.10.1 Company Basic Information, Manufacturing Base and Competitors
9.10.2 IC Package Substrate Product Type, Application and Specification
9.10.2.1 Ball Grid Array(BGA)
9.10.2.2 Chip Scale Package/Chip Size Package(CSP)
9.10.3 Samsung IC Package Substrate Sales, Revenue, Price and Gross Margin (2012-2017)
9.10.4 Main Business/Business Overview
9.11 Shinko

10 IC Package Substrate Maufacturing Cost Analysis
10.1 IC Package Substrate Key Raw Materials Analysis
10.1.1 Key Raw Materials
10.1.2 Price Trend of Key Raw Materials
10.1.3 Key Suppliers of Raw Materials
10.1.4 Market Concentration Rate of Raw Materials
10.2 Proportion of Manufacturing Cost Structure
10.2.1 Raw Materials
10.2.2 Labor Cost
10.2.3 Manufacturing Process Analysis of IC Package Substrate
10.3 Manufacturing Process Analysis of IC Package Substrate

11 Industrial Chain, Sourcing Strategy and Downstream Buyers
11.1 IC Package Substrate Industrial Chain Analysis
11.2 Upstream Raw Materials Sourcing
11.3 Raw Materials Sources of IC Package Substrate Major Manufacturers in 2015
11.4 Downstream Buyers

12 Marketing Strategy Analysis, Distributors/Traders
12.1 Marketing Channel
12.1.1 Direct Marketing
12.1.2 Indirect Marketing
12.1.3 Marketing Channel Development Trend
12.2 Market Positioning
12.2.1 Pricing Strategy
12.2.2 Brand Strategy
12.2.3 Target Client
12.3 Distributors/Traders List

13 Market Effect Factors Analysis
13.1 Technology Progress/Risk
13.1.1 Substitutes Threat
13.1.2 Technology Progress in Related Industry
13.2 Consumer Needs/Customer Preference Change
13.3 Economic/Political Environmental Change

14 Global IC Package Substrate Market Forecast (2017-2022)
14.1 Global IC Package Substrate Sales, Revenue and Price Forecast (2017-2022)
14.1.1 Global IC Package Substrate Sales and Growth Rate Forecast (2017-2022)
14.1.2 Global IC Package Substrate Revenue and Growth Rate Forecast (2017-2022)
14.1.3 Global IC Package Substrate Price and Trend Forecast (2017-2022)
14.2 Global IC Package Substrate Sales, Revenue and Growth Rate Forecast by Regions (2017-2022)
14.2.1 United States IC Package Substrate Sales, Revenue and Growth Rate Forecast (2017-2022)
14.2.2 China IC Package Substrate Sales, Revenue and Growth Rate Forecast (2017-2022)
14.2.3 Europe IC Package Substrate Sales, Revenue and Growth Rate Forecast (2017-2022)
14.2.4 Japan IC Package Substrate Sales, Revenue and Growth Rate Forecast (2017-2022)
14.2.5 Southeast Asia IC Package Substrate Sales, Revenue and Growth Rate Forecast (2017-2022)
14.2.6 India IC Package Substrate Sales, Revenue and Growth Rate Forecast (2017-2022)
14.3 Global IC Package Substrate Sales, Revenue and Price Forecast by Type (2017-2022)
14.4 Global IC Package Substrate Sales Forecast by Application (2017-2022)

15 Research Findings and Conclusion

16 Appendix
Methodology
Analyst Introduction
Data Source

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