Report On MEMS Packaging
The MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry
MEMS PACKAGING MARKET IS GROWING FASTER THAN IC PACKAGING MARKET
In package unit shipments, the MEMS packaging market is growing 2x faster (~ 20% CAGR) than what is predicted for the overall IC package market. WLP / TSV platform is set to grow the fastest while leadframe and organic laminate based packages are poised to grow a comfortable 16% CAGR over the next 5 years to come. http://www.bharatbook.com/market-research-reports/consumer-electronics-market-research-report/mems-mems-packaging.html
There are plenty of MEMS and sensors to be found in recent smartphone designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters & duplexers, RF switches and MEMS oscillators: there is no doubt that MEMS content is growing faster than standard IC content.
CHANGING THE PARADIGM
In terms of how the packaging is involved, it’s all about orchestrating the assembly of MEMS sensor and their related ASIC inside a module. But this is costly: packaging, assembly, test and calibration steps account for nearly 35% to 60% of a total MEMS packaged module’s cost. MEMS Packaging
MEMS types of packaging are more complex than most standard IC packages because they require “System-in-Package” type of assembly. Additionally, most MEMS packages are connecting sensors to their final environment, bringing very specific constraints at the module level such as building a cavity, a hole in the substrate or metal lead for pressure sensor and microphones, an optical window for optical MEMS, a full vacuum hermeticity at the die level.
The application scope of MEMS is broad and very diversified. Since its early beginnings, the MEMS industry faced the issue of being a highly fragmented market, with NO manufacturing standards clearly emerging
Packaging always needed to cope with the very specific end-applications requirements of MEMS modules
However, the MEMS law “One MEMS = 1 Device with 1 Process with 1 Package” is now changing as several packaging platform standards are now clearly emerging (such as WLP & TSV interconnects, SiP module assembly based on molded or cavity packaging for e.g.)
This report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates such as ceramic, leadframe and organic laminates.
STANDARDS ARE ON THE WAY
While there are a lot of developments happening for high reliability, low cost MEMS packages in the automotive, medical and industrial application space, the number of MEMS and sensors going into mobile, consumer and gaming applications is expected to continue to skyrocket, driving integration of an incredibly high number of MEMS and sensor devices in unprecedented volume. As a result, OSAT and wafer foundry players are getting more and more interest in MEMS module packaging, as volume and complexity of MEMS SiP modules is increasing dramatically, implying several key trend in this space:
IDMs needs to find second sources partners and qualify some OSATs in order to secure their supply chain
Standardization (coming from both foundries, OSAT, WLP houses or substrate suppliers) is critical and necessary to implement in order to keep the packaging, assembly, test and calibration cost of MEMS modules under control.
KEY FEATURES OF THE REPORT
* To provide market data on key MEMS packaging industry market metrics & dynamics
Focus on key MEMS applications (including Silicon microphones, gyroscopes, accelerometers, magnetometers, fusion sensor combo units & IMU, pressure sensors, TPMS modules, micro-mirrors, micro-bolometers, oscillators & resonators, switches, FBAR/BAW filters, SAW filters, ink-jet MEMS modules, microfluidic & Biochips, micro-displays, micro-actuator auto-focus, etc…)
MEMS package and substrate unit shipments and revenues application by application
Market shares for key MEMS player with detailed breakdown inside each MEMS applicative segment
* To provide technical insight about key MEMS packaging technology trends & challenges
From MEMS-ASIC integration trends (SiP module versus SOC) to interconnect trends (wire-bond versus flip-chip versus WLP / TSV) to substrate approach (ceramic, leadframe, organic laminate, silicon/glass interposers)
Teardowns module analysis and reverse costing analysis of the main key MEMS package modules design wins from top tiers player leaders in their respective applicative market space
Specific requirements in each MEMS packaging applications along with packaging technologies roadmaps
Focus on final test and calibration trends which represent more than 20-30% of the total MEMS modules value
* To provide a deep understanding of the MEMS packaging value chain, infrastructure & players
Who are the key players (IDMs, fab-less, wafer foundries, packaging & test subcontractors) involved in the MEMS packaging business and how are they related?
Where is the value in the MEMS packaging, assembly, test & calibration area depending on each application? How this value is shared among the different business models in this space and how does this value flows?
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