3D Silicon and Glass Interposers
This report contains a list of all the 3D silicon/glass interposer opportunities by application. We analyze the key drivers, expected benefits, and the various technology options and alternatives. In addition we will cover the 3D interposer industry players and the respective supply chain changes. ( http://www.bharatbook.com/detail.asp?id=155401&rt=3D-Silicon-and-Glass-Interposers.html )
Several concurrent factors account for the growing momentum of 3D silicon and glass interposers: the continuously increasing gap between printed circuit boards and integrated circuits, both in terms of geometries and materials, has driven research and development of new innovative semiconductor assembly and packaging solutions over the past 10 years, including System-in-Package (SiP), Package-on-package (PoP), flip-chip Ball grid Array (fc-BGA) or more recently fan-out Wafer Level Packaging. The introduction of these recent technologies fills the gap by offering finer pitch interconnections and by alleviating the external IO interface thanks to recombined interconnections inside the package. However, a growing number of industry players now claim that the gap has become so wide that a new disruptive technology, such as 3D silicon or glass interposers, is needed.
Concurrently, the so-called “mid-end infrastructure” (foundries for wafer-level packaging operations) has developed at an unprecedented pace over the past 3 years to meet the growing demand for Wafer-Level Chip-Scale Packaging (or “fan-in WLCSP”) and flip-chip. These new facilities, half way between front-end foundries and conventional assembly and packaging facilities now support high volume manufacturing on large size wafers, thus permitting economies of scale. These players, in search of growth opportunities, have positioned as service providers for the back-end operations for the making of through silicon vias (TSV’s) and other related wafer-level assembly operations. Thanks to 3D silicon/glass interposers, they can go one step further, and actually propose products combined with their service offer.
KEY FEATURES OF THE REPORT
* Detailed account of all the application fields of 3D interposers (examples are logic, logic+memory, 3D RF/analogue integrated passive and MEMS capping interposers…)
* Drivers and expected benefits by application
* Comparison with technology alternatives and likeliness of 3D interposer penetration by application
* Market trends and figures with breakdown by application, substrate type, wafer and panel size
* Analysis of target wafer prices for a few key applications
* Cost analysis of several technology and industrial cases
* Supply chain analysis: main manufacturers and contract assemblers for 3D interposers, likely high volume players. Design, test and liability considerations
For more information kindly visit : http://www.bharatbook.com/detail.asp?id=155401&rt=3D-Silicon-and-Glass-Interposers.html
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