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Wire Wedge Bonder Equipment Market Research Report 2017

Press Release   •   Jan 08, 2018 16:32 IST

This report studies the Wire Wedge Bonder Equipment market status and outlook of global and major regions, from angles of manufacturers, regions, product types and end industries; this report analyzes the top manufacturers in global and major regions, and splits the Wire Wedge Bonder Equipment market by product type and applications/end industries.


Compared to 2015, Wire Wedge Bonder Equipment market increased sales by 1.28 percent to 90.23 million USD worldwide in 2016 from 89.09 million USD in 2015. It shows that the Wire Wedge Bonder Equipment market performance is positive, despite the weak economic environment. The global Wire Wedge Bonder Equipment market is expected to reach $96.62 million by 2022 from $91.73 million in 2017, growing at a CAGR of 1.04% from 2017 to 2022.

The major players in global Wire Wedge Bonder Equipment market include
Kulicke & Soffa
ASM Pacific Technology (ASMPT)
Hesse
Cho-Onpa
F&K Delvotec Bondtechnik
Palomar Technologies
DIAS Automation
West-Bond
Hybond
TPT

Geographically, this report is segmented into several key Regions, with production, consumption, revenue, market share and growth rate of Wire Wedge Bonder Equipment in these regions, from 2012 to 2022 (forecast), covering
North America
Europe
China
Singapore
ROW

On the basis of product, the Wire Wedge Bonder Equipment market is primarily split into
Fully Automatic
Semi-automatic
Manual

On the basis on the end users/applications, this report covers
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

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Table Of Content-

1 Wire Wedge Bonder Equipment Market Overview 1
1.1 Product Overview and Scope of Wire Wedge Bonder Equipment 1
1.2 Wire Wedge Bonder Equipment Segment by Types (Product Category) 2
1.2.1 Global Wire Wedge Bonder Equipment Production (Unit) and Growth Rate (%) Comparison by Types (2012–2022) 2
1.2.2 Global Wire Wedge Bonder Equipment Production Market Share (%) by Types in 2016 3
1.2.3 Fully Automatic 4
1.2.4 Semi-automatic 5
1.2.5 Manual 6
1.3 Global Wire Wedge Bonder Equipment Segment by Application 6
1.3.1 Global Wire Wedge Bonder Equipment Production (Unit) Comparison by Applications (2012–2022) 6
1.3.2 Integrated Device Manufacturers (IDMs) 7
1.3.3 Outsourced Semiconductor Assembly and Test (OSAT) 8
1.4 Global Wire Wedge Bonder Equipment Market by Regions (2012–2022) 9
1.4.1 Global Wire Wedge Bonder Equipment Market Size Comparison by Regions (2012–2022) 9
1.4.2 North America Wire Wedge Bonder Equipment Status and Prospect (2012–2022) 10

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