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IO-Link Market 2019 with Business Trends, Segmentation Analysis and Eminent Key Players Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc.

Press release   •   Jul 01, 2019 12:30 IST

This market research report provides a big picture on “IO-Link Market”, on a Global basis, offering a forecast and statistic in terms of revenue during the forecast period. The report covers a descriptive analysis with detailed segmentation, complete research and development history, latest news and press releases. Furthermore, the study explains the future opportunities and a sketch of key players involved in the “IO-Link Market’s hike in terms of revenue.

Every crucial and decisive detail for the development of the market and the restraining factors that may hamper the market in near future is mentioned with solutions in the report. Segmentations of the market are studied specifically to give profound knowledge for supplementary market investments.

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Companies Mentioned:-

Siemens AG

Balluff GmbH

Ifm Electronic GmbH


Rockwell Automation Inc.

Festo AG & Co.KG.

OMRON Corporation

Banner Engineering Corporation

Hans Turck GmbH & Co.KG

Datalogic S.p.A.

The growing focus on optimizing resources, increasing efficiency and reducing production costs, growth in digital industrial technology, government initiatives towards the adoption of industrial automation are the significant factors driving the growth of the market. Moreover, availability of cloud interface in IO-Link and launch of IO-link safety specification in 2017 is expected to provide significant opportunities for the IO-link market in the forecast period. However, lack of standardization and the usage limitations of IO-link's in high-speed applications is anticipated to hamper the growth of the IO-link market.

Detailed segmentation of the market, on the basis of Type and Application and a descriptive structure of trends and restrictions of the segments and sub-segments are mentioned in the report. It also provides the market size and estimates a forecast from the year 2019 to 2027 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South & Central America. The report also provides exhaustive PEST analysis for all five regions after evaluating political, economic, social and technological factors effecting the IO-Link market.

The report assists in determining and analyzing the Key market players’ portfolios with information such as company profiles, components and services offered, financial information of last 3 years, key developments in past five years and helps in constructing strategies to gain competitive advantage. The market payers from IO-Link Market are anticipated to lucrative growth opportunities in the future with the rising demand for IO-Link in the global market. Below mentioned is the list of few companies engaged in the IO-Link market.

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Answers that the report acknowledges:

  • Market size and growth rate during forecast period.
  • Key factors driving the “IO-Link” market.
  • Key market trends cracking up the growth of the “IO-Link” market.
  • Challenges to market growth.
  • Key vendors of “IO-Link” market.
  • Detailed SWOT analysis.
  • Opportunities and threats faces by the existing vendors in Global “IO-Link” market.
  • Trending factors influencing the market in the geographical regions.
  • Strategic initiatives focusing the leading vendors.
  • PEST analysis of the market in the five major regions.

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