In terms of geography, North America dominates the global flexible substrates market due to improved electronics technologies in this region. The U.S. represents the largest market for flexible substrates, followed by Canada in North America. In Europe, Germany, the U.K., Spain, Italy, and France hold major share of the flexible substrates market. Asia is expected to witness high growth rates in the next five years in the flexible substrates market, as many companies are constructing manufacturing facilities in this region. Less stringent wagesand availability of skilled labor attracts manufacturing companies to invest in Asia. In addition, improving electronics technologies is also boostinggrowth of the flexible substrates market in this region. Japan, China, and India are expected to be the fastest-growing flexible substrates markets in Asia .
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Emerging field of printed electronics technologies is the key driver of growth of the global flexible substrates market. Printed electronics technologies are used to create electrical devices on various substrates. In addition, increasing demand for organic light emitting diodes (OLED) is also boosting growth of the global flexible substrates market. OLEDs are light-emitting panels made from carbon-based organic materials that emit light when electricity is applied. OLEDs are used to make beautiful and efficient displays, and to create white light panels for lighting.
Moreover, development of flexible medical devices and increasing adoption of organic electronics-based IC designing methods for non-invasive monitoring devices indicatepotential for growthofthe global flexible substrates market.
However, stringent regulations restrain growth of the global flexible substrates market. Rising product launches and increasing number of mergers and acquisitions among drug manufacturing companies are some of the latest trends in the global flexible substrates market.
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Some of the major companies operating in the global flexible substrates market are E.I. DuPont de Nemours and Company, Heraeus Materials Technology GmbH & Co. KG, SCHOTT North America, Inc., Heraeus Packaging Technology, American Semiconductor, Inc., 3M Company, Arlon Graphics LLC, BenQ Materials Corporation, Griff Paper and Film, AzCoat, Inc., Corning, Inc., Rogers Corporation, Porex Corporation, Polyonics, Inc., and Griff Paper and Film.
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