The global broad ion beam technology market was valued at US$ 179.83 Mn in 2016 and is anticipated to expand at a CAGR of 8.7% from 2017 to 2025. Ion beam technology is a technologically advanced method which is being primarily used across material science and semiconductor industry and also progressively used in the biological field for the purpose of ablation and deposition of materials as well as for site specific analysis.
Broad ion beams are being used for the purpose of conventional ion etching, thinning, polishing, depth profiling and cutting. In broad ion beam applications, additional ion beam polishing steps is used for the purpose of polishing of the slope or selective etching to reveal the internal microstructure not only of the slope cut but also of the sputtered region and initial surface. Increasing demand of broad ion beam in multi-step processing for 3D investigation of microstructures is expected to drive the market during the forecast period.
Broad ion beam market is mainly driven by the lower cost of fabrication using broad ion beam milling. Broad ion beam milling is another type of ion beam lithography which uses low energy noble gas ion beams like argon and helium. Broad ion beam milling techniques are being widely used for the purpose of re-shining samples for transmission electron microscope.
Moreover, increasing application of broad ion beam in nano machining is also predicted to create a better opportunity for various broad ion beam equipment manufacturers in the coming years. Powerful and large ion sources are the main component in case of neutral gas injectors for the fusion devices. Moreover, the broad beam ion sources are being used for the electrically powered spacecraft propulsion. The most important factor retarded the demand may be due to the operational complications. Disproportionate ion?beam current is also objectionable since it leads to a rapid wear of accelerator grid, increases the target impurity, and very little or no increase in the process rate.
Broad ion beam technology market has been segmented on the basis of application and end use industry. By application, broad ion beam market is categorized mainly into six categories such as structuring of MEMS, MRAM and sensors, metallic and dielectric multilayers, ion beam polishing, micro structuring, chemically assisted ion beam etching and delayering (failure analysis). Based on end use industry, broad ion beam market is segmented mainly into nine categories those are semiconductor, MEMS, MOEMS, optics, optoelectronics, sensors, storage devices, electronics and others. Due to rapid growth of the thin film market owing to rapid technological advancements taking place in photovoltaic solar cells, Microelectromechanical systems (MEMS) and semiconductors industry, the broad ion beam deposition system is predicted to witness a promising rate in the coming years.
Globally broad ion beam technology market on the bass of geography is segmented into North America (U.S, Canada, Rest of North America), South America (Brazil and Rest of South America), Europe (Germany, U.K., France and Rest of Europe), Asia Pacific (China, India, Japan and Rest of Asia Pacific), and Middle East & Africa (GCC, South Africa and Rest of Middle East & Africa).
The largest area of new opportunity for growth in the U.S. optoelectronics industry appears to be optical sensor technology. Japanese R&D posture in this field lags behind that of the U.S. and is expected to remain the same in coming years. It also appears that the sensors field has tremendous growth potential that U.S. industry is well-positioned to exploit. One other area where the U.S. might succeed in capturing a significant market share is optical storage. At present the Japanese photonics industry is ahead in both manufacturing and R&D for optical storage, but several opportunities exist for major advances in read/write devices and in storage media technology.
Major players operating in the global broad ion beam technology market are Meyer Burger Technology, 4Wave Incorporated, Veeco Instruments Inc., Scia Systems GmbH, Oxford Instruments, Hitachi High-Technologies Corporation, Plasma-Therm, Raith GmbH, FEI and Canon Anelva Corporation among others.
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