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Features of Bus Switch IC Market 2017 to 2021

Press Release   •   Aug 08, 2017 01:26 EDT

The analysts forecast Global Bus Switch IC Market to grow at a CAGR of 4.20% during the period 2017-2021. One trend in the market is growing use of high-speed gigabit Ethernet. Gigabit Internet is known as the next generation of broadband Internet service, and it is delivered over fiber optic lines and provides speeds of nearly 1,000 Mbps, which is also referred to as 1 Gbps or gigabit Internet.”

About Bus Switch IC

Bus switches are connected to high-speed digital buses. Their main characteristics are sub-nanosecond propagation delays and fast switching. Also, they do not create additional noises. They are suitable for voltage translation, hot swapping, hot plug, bus or capacitance isolation, and many other applications. Bus switch ICs are used to increase the speed and reduce the noise by isolating functions that do not need to drive the bus (or be driven by it) at any given moment, but may need to be connected later.

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According to the report, one driver in the market is growing demand for cloud computing and IoT. The global IoT market is being amplified by the increasing rates of globalization and urbanization in all regions. A surprising number of users across the world today have access to multiple branches of IT, data sharing and storage methods, cloud computing solutions, and communication portals. Within the next three years, it is expected that more than 80% of all data center traffic will be cloud based. Also, most of this action will be going to public cloud services; there will be more workloads (nearly 54%) in the public cloud than in private clouds (46%).

Covered in this report

The report covers the present scenario and the growth prospects of the global bus switch IC market for 2017-2021. To calculate the market size, the report considers shipments, sales, volume, and value.

The market is divided into the following segments based on geography:

Americas

APAC

EMEA

Further, the report states that one challenge in the market is rapid technological changes. The fast developments in wafer processing is a major challenge for the vendors of bus switch ICs. The miniaturization of nodes, the increase in wafer sizes, and the increasing applications of the ultra-large-scale integration (ULSI) fabrication technology are steadily becoming visible in the global semiconductor industry. These factors are prompting the manufacturers of semiconductors to focus on developing and adopting new technologies, particularly in packaging solutions.

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The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

This report, Global Bus Switch IC Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

Toshiba

Texas Instruments

NXP Semiconductors

Other prominent vendors

Diodes

Integrated Device Technology (IDT)

Microsemi

Nexperia

ON Semiconductor

WeEn Semiconductors

Market driver

Growing demand for cloud computing and IoT

For a full, detailed list, view our report

Market challenge

Rapid technological changes

For a full, detailed list, view our report

Market trend

Growing use of high-speed gigabit Ethernet

For a full, detailed list, view our report

Key questions answered in this report

What will the market size be in 2021 and what will the growth rate be?

What are the key market trends?

What is driving this market?

What are the challenges to market growth?

Who are the key vendors in this market space?


Table of Contents

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

PART 05: Market landscape

PART 06: Market segmentation by application

PART 07: Geographical segmentation

PART 08: Decision framework

PART 09: Drivers and challenges

PART 10: Market trends

PART 11: Vendor landscape

PART 12: Key vendor analysis

PART 13: Appendix

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