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Global Semiconductor Advanced Packaging Market Booming At CAGR Of 8.45% Between 2017-2021

Press Release   •   Aug 14, 2017 06:21 EDT

Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components. Semiconductor advanced packaging is a key component of the semiconductor manufacturing process. The package of a semiconductor device is usually made of materials such as plastic, metal, ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion. It also has contact pins or leads used to connect external circuits to the device; the package also dissipates the heat produced in the device. Some of the advanced packaging technologies used in semiconductor device packaging are fan-out wafer-level packaging (FO WLP), flip-chip, fan-in wafer-level packaging (FI WLP), and 2.5D/3D.

Technavios analysts forecast the global semiconductor advanced packaging market to grow at a CAGR of 8.45% during the period 2017-2021.

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Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor advanced packaging market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-use segments.

The market is divided into the following segments based on geography:
  • Americas
  • APAC
  • EMEA
Technavios report, Global Semiconductor Advanced Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

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Key vendors
  • Advanced Semiconductor Engineering (ASE)
  • Amkor Technology
  • Samsung Semiconductor (SAMSUNG)
  • TSMC (Taiwan Semiconductor Manufacturing Company)
Other prominent vendors
  • China Wafer Level CSP
  • ChipMOS TECHNOLOGIES
  • FlipChip International
  • HANA Micron
  • Interconnect Systems (Molex)
  • Jiangsu Changjiang Electronics Technology (JCET)
  • King Yuan Electronics
  • Tongfu Microelectronics
  • Nepes
  • Powertech Technology (PTI)
  • SIGNETICS
  • Tianshui Huatian
  • Ultratech
  • UTAC
Market driver

Complex semiconductor IC designs

For a full, detailed list, view our report

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Market challenge

Rapid technological changes

For a full, detailed list, view our report

Market trend

Changes in wafer size

For a full, detailed list, view our report

Key questions answered in this report

What will the market size be in 2021 and what will the growth rate be?

What are the key market trends?

What is driving this market?

What are the challenges to market growth?

Who are the key vendors in this market space?