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Global Semiconductor Chip Packaging Market To Grow At A CAGR Of 31.1% During The Period 2017-2021

Press Release   •   Jan 31, 2017 07:18 EST

MarketResearchReports.biz has recently announced the addition of a market study “ Global Semiconductor Chip Packaging Market 2017-2021 ”, is a comparative analysis of the global market.

About Semiconductor Chip Packaging

The growth in the applications of semiconductor chips in industries such as the power, energy, medical, electric vehicles, automobiles, networking and telecommunications, consumer applications, military, aerospace and defense, motor control applications, and robotics is driving the market. Thus, the market for packaging equipment is expected to gain substantial ground during the forecast period, as packaged chips are used to improve functionality and performance of the devices in which they are applied.

Technavios analysts forecast the global semiconductor chip packaging market to grow at a CAGR of 31.1% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor chip packaging market for 2017-2021. To calculate the market size, the report considers the revenue generated from semiconductor chip packaging.

The market is divided into the following segments based on geography:

Americas

APAC

EMEA

Technavio's report, Global Semiconductor Chip Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Download The sample Copy Of This Report: http://www.marketresearchreports.biz/sample/sample/938682

Key vendors

Applied Materials

ASM Pacific Technology

Kulicke & Soffa Industries

TEL

Tokyo Seimitsu

Market driver

Growing number of fabs

For a full, detailed list, view our report

Market challenge

Increasing complexity of semiconductor IC designs

For a full, detailed list, view our report

Market trend

Development of 3D chip packaging

For a full, detailed list, view our report

Key questions answered in this report

What will the market size be in 2021 and what will the growth rate be?

What are the key market trends?

What is driving this market?

What are the challenges to market growth?

Who are the key vendors in this market space?

What are the market opportunities and threats faced by the key vendors?

What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analysts time when you purchase this market report. Details are provided within the report.

Table Of Content

PART 01: Executive summary

PART 02: Scope of the report

Market overview

Base year

Market reportage

Geographical coverage

Vendor segmentation

Common currency conversion rates

Top-vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

PART 05: Technology landscape

Semiconductor IC manufacturing process

WLP versus die-level packaging and assembly

Roadmap of semiconductor packaging industry

Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape

Market overview

Market size and forecast

Five forces analysis

PART 07: Market segmentation by OSATs and IDMs

Global semiconductor chip packaging market by OSATs and IDMs

OSATs

IDMs

PART 08: Market segmentation by packaging techniques

Flip-chip wafer bumping

2.5D interposers

Fan-in WL CSP

3D WLP

FO WLP/SiP

3D IC TSV stacks

PART 09: Geographical segmentation

Market overview

APAC

Americas

EMEA

PART 10: Key leading countries

USA

Taiwan

PART 11: Market drivers

Growing number of fabs

Increase in miniaturization of electronic devices

High adoption of semiconductor ICs in automobiles

Increase in number of fabless semiconductor companies

PART 12: Impact of drivers

PART 13: Market challenges

High initial investment

Increasing complexity of semiconductor IC designs

Rapid technological changes

PART 14: Impact of drivers and challenges