Transparency Market Research (TMR), A Market Intelligence And Research Firm, Has Published A Research Study On "Semiconductor Packaging Material Market".Semiconductor packaging materials refer to materials that are used for the protection of electronic components such as semiconductors and integrated circuits (ICs) from corrosion, external collision, and other harmful factors. The use of a host of advanced technologies on global semiconductor packaging materials market enables efficient and secure packaging of semiconductors and integrated circuits.
In present times, the burgeoning use of mobile communication devices such as tablets and smartphones is one of the major factors driving the semiconductor packaging material market. The functioning of these devices is based on a complex network of numerous semiconductors integrated for sending and receiving signals, which is the basis of communication for the devices. Thus, with the continued growth of the mobile devices market, the demand for semiconductor packaging materials will be on the rise in the coming years.
Currently, Asia Pacific is a major hub of the semiconductor packaging material market. The presence of some of the largest electronic corporations in the world in the region accounts for the large and well-established presence of the semiconductor packaging material market in Asia Pacific.In some of the countries in Asia Pacific, such as China, Indonesia, and India, the emerging middle class, which has a handsome chunk of disposable income to spend, is generally impulsive in its buying habits. Middle-class consumers readily trade old electronic devices for newer gadgets, which is consistently driving demand for electronic components for these devices. Thus, the semiconductor packaging material market is benefitted in the region.
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Among the regional markets for semiconductor packaging materials, Europe and North America follow Asia Pacific in terms of revenue. Europe and North America exhibit similar conditions in the semiconductor packaging material market. In North America, the U.S. is one of the largest markets for semiconductor packaging materials, with the U.S. economy recovering in recent years to reach close to the pre-recession economic levels.In Europe, Germany holds the largest market share in the semiconductor packaging material market, trailed by Italy, France, and the U.K.
Semiconductor packaging materials are of eight types, namely bonding wires, die attach materials, encapsulation resins, solder balls, leadframes, organic substrates, ceramic packages, and thermal interface materials. Currently, organic substrates comprise the largest product segment of the global market for semiconductor packaging materials. As a standard, bonding wires have been used for semiconductor packaging, but the trend is shifting towards copper bonding wires as observed in the recent past. However, the encapsulation resins segment of the market is expected to display strong growth in the semiconductor packaging material market due to their novelty and various benefits over other packaging materials.
On the basis of application, the use of semiconductor packaging materials is application-specific and adheres to certain standard specifications followed across the globe. Some of the packaging technologies used around the world are GA, QFN, QFA, SOP, DFN, and others that are dependent on the end use.Some of the companies that have a significant presence in the global semiconductor packaging material market are Hitachi Chemical Co. Ltd., Henkel AG & Company, Alent plc, BASF SE, Sumitmo Chemical Co. Ltd., and Kyocera Chemical Co. Ltd. amongst others.
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