Passive heatsinks and heat distribution for UCS electronics housings

Embedded systems and single-board computers are becoming increasingly powerful with more compact dimensions. To facilitate reliable operation, coordinated heat dissipation concepts are required. Phoenix Contact therefore offers an integrated heatsink/heat spreader combination for the Universal Case System (UCS) housing series.

Areas subject to thermal loads on the PCBs are not homogeneously distributed. In order to optimise the thermal design in the devices, individually adjustable UCS HSP heat spreaders are positioned and screwed onto the prepared contact surface of the UCS HS-HH heatsink. The heatsink and heat spreader combination is then connected to the PCB via spacer bolts. This enables the necessary contact pressure and thermal contact to be achieved. The available portfolio supports the optimal positioning and attachment of various PCBs. The UCS HS-SW heatsinks, which are designed as a side panel, are suitable for connecting wired components. They integrate a support surface for the PCB to mechanically stabilise the arrangement.

The new heat dissipation solutions extend the flexibility and possible applications of the UCS modular system. Users can implement numerous applications individually based on the modular principle. Customised printing on the housing parts in combination with printing on the heatsinks on the surface provided rounds out the system.