Nidec Advance Technology Launches the New AURCA-series, an AI-based Inspection & Measurement Solution for Semiconductors and Printed Substrates

Nidec Advance Technology Corporation (“Nidec Advance Technology” or the “Company”) announced today the launch of the AURCA series, an AI-based inspection & measurement solution for semiconductors and printed substrates

■ How the product was developed
As the electronic device market expands driven by AI recently, high-level trust is required for the increasingly miniaturized and complex semiconductor manufacturing process. Under these circumstances, Nidec Advance Technology has developed the AURCA series as a solution to solve issues at the manufacturing scene, including addressing defects, which has been difficult with the conventional imagery inspection method, and improving yield.

■ Main features of the AURCA series

1. Advanced defect detection (AI-based image processing): Using a unique AI-based algorithm, the AURCA series detects, with high accuracy, defects and abnormalities that have been difficult to identify in conventional inspections.
2. Full-color optical inspection: By obtaining full-color images based on an advanced optical design, the AURCA series can capture changes in a subject’s material and heights to reduce over-detection significantly.
3. Single, simultaneous processing of an image with multiple light sources: Using multiple light sources optimized for defects to detect, the AURCA series performs simultaneous scanning to inspect all kinds of defects instantaneously.

■ Values that the AURCA series offers
In addition to detecting defective units, the AURCA series performs advanced AI-based measurement and utilizes analytical data to help manufacturing sites improve their yield.

1. True-root-cause defect analysis: Capable of analyzing in detail the shapes and occurrence tendency of AI-detected defects, not only does the AURCA series simply make OK/Not OK judgments, but it also supports users to identify why such defects have occurred.
2. Direct feedback to those in the manufacturing process: The AURCA series promptly provides the preceding process with analytical results, which can be used to review the manufacturing process and make recurrence prevention measures.
3. Constant yield improvement cycle: By constantly rotating the “inspection → analysis → feedback → process improvement” cycle, the AURCA maximizes the yield of customers’ entire factories and greatly contributes to manufacturing cost reduction and product reliability improvement.