Press release -
Nidec Advance Technology to Exhibit Products at Testing Expo China - Automotive 2025
Nidec Advance Technology Corporation (“Nidec Advance Technology” or the “Company”) has announced today that it will exhibit products at Testing Expo China - Automotive 2025 – an event to take place at Shanghai World Expo Exhibition & Convention Center from Wednesday, August 27 – Friday, August 29, 2025.
Nidec Advance Technology will be showcasing products for the first time at this event – held in Europe, the US, Asia and elsewhere annually – for companies that provide equipment and services on vehicle testing, equipment, and quality engineering.
At its booth, the Company will display a series of its long-nurtured electric vehicle (EV) inspection solutions, including EV motor test benches, motor characteristics test simulators, and automotive power module testing equipment.
In addition, Nidec Advance Technology will demonstrate how to operate its E-Transport Simulator, a simulation tool to create a digital twin during an EV’s design analysis, to offer realistic experiences for visitors.
About Testing Expo China - Automotive 2025
- Period: Wednesday, August 27 – Friday, August 29, 2025
- Venue: Shanghai World Expo Exhibition & Convention Center
- Booth: 10290
- Official website: www.testingexpo-china.com
Nidec Advance Technology’s main exhibits will include:
- TDAS-Series
- xEV Modeling Simulator
- Reference Inverter
- IGBT/SiC (semiconductor power module inspection equipment)
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Nidec is the world's leading comprehensive motor manufacturer, specializing in "everything that spins and moves," with a strong focus on the motor business. Nidec's extensive product lineup, which ranges from small precision motors to ultra-large motors, leverages the technological capabilities of its approximately 340 group companies across 46 countries. These products are used in various fields, including IT equipment, automobiles, motorcycles, commerce, and industry. We remain dedicated to providing the world with indispensable products and solutions at an overwhelming speed, utilizing technologies aimed at lightness, thinness, shortness, compactness, and efficiency.
