SMART INDUSTRIES BY ANALOG POWER -- Exhibiting at TECHNO-FRONTIER 2015, ROHM Semiconductor to Reveal Several Key Devices that Make Reduced Size and Energy Usage of Industrial Equipment a Reality

ROHM Semiconductor (Head Office: Kyoto) will be exhibiting at TECHNO-FRONTIER 2015, which will be held at Makuhari Messe from 20 May. 

Carrying over from last year, ROHM Semiconductor will have  as its theme. It will be exhibiting a wide variety of key devices that achieve highly efficient power conversion – an amalgamation of state-of-the-art power device technology, LSI control technology, and module technology that incorporates the two.

In the corner for SiC power devices, ROHM Semiconductor will exhibit several products such as increasingly relevant SiC-loaded applications, as well as its world-first, mass-produced trench-structured SiC-MOSFET. On Day Three of the event, Friday, 22 May, President of Fukushima SiC Applied Engineering Inc., Mr Yuji Kokubo, will present on the principles and applications of the latest ultra-high voltage SIC-pulse generators at a lunch session. It is planned that ROHM Semiconductor will also be participating here, introducing state-of-the-art SiC products and technologies that are progressing in their use towards high-voltage applications.

Other attractions at the event will naturally be showings specific to ROHM’s analog power technology – including the ‘Photocoupler-Insulated Flyback Converter’, which promises to contribute to the size-minimization of applications. Additionally, there will be the ‘Bluetooth ^Ⓡ Smart General-Purpose Low-Energy Wireless Module’ from Lapis Semiconductor, a subsidiary of the ROHM Group.

Furthermore, inside the booth there will six sub-themes, including the highly efficient, low-energy ‘Motor Driver’ for the next generation of motors, as well as the HEMS・IoT-optimal ‘Wi-SUN General-Purpose Wireless Module’. With this, engineers will be on hand each day to conduct presentations and familiarize patrons with ROHM technologies.

＜Image: ROHM’s Corner Booth＞

＜ROHM Booth Attractions＞

1． SiC Power Devices

・Full SiC Power Modules that achieve high currency （1200V / 300A）

・Pulse generators fitted with the high-performance, micro SiC-MOSFET

2．　 Power Devices

・HybridMOS, a newly designed electrical transistor that boasts both SJ MOSFET and IGBT characteristics

・Newly designed Sulfur-Tolerant Chip Resistor, which can be safely used in sulfur-rich environments such as with automobiles and industrial equipment

3．　 Power Management

・Photocoupler-Insulated Flyback Converter, which is long running and improves equipment safety 

・Organic thin film solar cells that can generating power effectively in both low- and high-UV environments

4．　 Motor Control

・3-Phase Brushless Motor Driver for polygon mirrors, enabling extremely low-revolution jitters in devices such as laser printers

・PrestoMOS ^TM-equipped IPM, which contributes to lowered power consumption in energy-saving household appliances and industrial equipment

5．　 Networks

・HD-PLC Inside Baseband IC, which is compatible with M2M and IoT

・Wireless module that is compatible with Wi-SUN, an international wireless communication standard optimized for smart communities

・Bluetooth ^Ⓡ Smart General-Purpose Low-Energy Wireless Module from Lapis Semiconductor, a subsidiary of the ROHM Group

＜Lunch Session Outline＞

■Day and Time：Friday, 22 May: 13:05–13:55

■Location：Makuhari Messe, Hall 4 Symposium

■Content of Lecture：

1) ‘Latest Technological Trends in SiC Power Devices’

– Taka Nakamura, Head of Research and Development, ROHM Co., Ltd.

2) ‘Principles and Applications of the Latest Ultra-High Voltage SIC-Pulse Generators’

– Yuji Kokubo, Managing Director, Fukushima SiC Applied Engineering Inc.

※Free to attend – lunch included

■Note： An entry badge is necessary for attendance at the lunch session.

Badges will be distributed at the ROHM Booth on Friday, 22 May from 10 am to 12 pm.

Due to limited numbers, please arrive early.