Yamaha Motor Releases YSB55w, a High-speed, High-accuracy Flip-chip Bonder

IWATA, August 26, 2015 – Yamaha Motor Co., Ltd (Tokyo: 7272) announced the development of the new YSB55w, a high-speed, high-accuracy flip-chip*1 bonder that achieves industry-leading productivity and high-accuracy bonding. This model will be released in December 2015.

The new YSB55w is a flip-chip bonder specially designed to bond flip-chips onto printed circuit boards, etc., with the flip-chips that are used in IT communications devices and digital appliances being manufactured in increasing numbers. It features a high-rigidity frame and dual bonding heads, and is fitted with a flip-chip recognition system employing a high-resolution camera. Developed to cater to a market increasingly focused on mass-production, Yamaha Motor has realized the high accuracy demanded of the latest leading-edge flip-chips, almost tripling the bonding capacity of existing Yamaha models at 13,000 UPH*2 for flip-chips from wafer supply (under optimal conditions, includes processing time), and doubling the bonding accuracy at ±5μm (3σ).

*1 Flip-chip: A type of semi-conductor integrated circuit (chip) that enables more compact and functionally-enhanced semi-conductor devices.

*2 UPH (Units Per Hour): Total number of chips that can be bonded in one hour. Yamaha Motor's existing model, the YSH20, operates at 4,500 UPH