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Categories: customer story

  • Aicomp Summit 2026 – Digital Future of the Packaging Industry

    The Aicomp Summit 2026 presents the latest technical developments and findings in the field of software for the packaging industry in lectures and technically demanding workshops. The hybrid event in Vienna from March 11 to 13, 2026, offers relevant information for both packaging manufacturers and digitization partners.

  • Aicomp Summit 2026 – Futuro digital de la industria del empaque

    La Aicomp Summit 2026 presenta los últimos avances técnicos y conocimientos en el ámbito del software para el sector del embalaje en conferencias y talleres especializados. El evento híbrido, que se celebrará en Viena del 11 al 13 de marzo de 2026, ofrece información relevante tanto para los fabricantes de embalajes como para los socios de digitalización.

  • Aicomp Summit 2026 – Digitale Zukunft der Verpackungsindustrie

    Das Aicomp Summit 2026 präsentiert neueste technische Entwicklungen und Erkenntnisse im Bereich Software für die Verpackungsbranche in Vorträgen und fachlich anspruchsvollen Workshops. Das Hybrid-Event in Wien vom 11. bis zum 13. März 2026 bietet relevante Informationen sowohl für Verpackungshersteller als auch für Digitalisierungspartner.

  • Aicomp Summit 2024 – Evento sobre la digitalización de la industria del envase y embalaje

    El evento Aicomp Summit 2024 presenta los últimos avances técnicos y conocimientos en el campo del software para la industria del envasado en presentaciones y talleres profesionalmente desafiantes. El evento híbrido que se celebrará en Berlín los días 14 y 15 de febrero de 2024 ofrece información relevante tanto para fabricantes de envases como para socios de digitalización.

  • Aicomp Summit 2024 – Event for the digitalization of the packaging industry

    The Aicomp Summit 2024 presents the latest technical developments and insights in the field of software for the packaging industry in presentations and professionally challenging workshops. The hybrid event in Berlin from February 14-15, 2024 offers relevant information for both packaging manufacturers and digitization partners.

  • Aicomp Summit 2024 – Event zur Digitalisierung der Verpackungsindustrie

    Das Aicomp Summit 2024 präsentiert neueste technische Entwicklungen und Erkenntnisse im Bereich Software für die Verpackungsbranche in Vorträgen und fachlich anspruchsvollen Workshops. Das Hybrid-Event in Berlin vom 14. bis zum 15. Februar 2024 bietet relevante Informationen sowohl für Verpackungshersteller als auch für Digitalisierungspartner.

  • Individuality and Sustainability: Rondo Ganahl AG Sets New Standards for Export Packaging with the MC-Box

    Since September last year, the MC-Box has been produced in St. Ruprecht, at the Styrian site of Rondo Ganahl AG. Modular packaging is a revolutionary concept for heavy goods: it is the first wood-free alternative to classic transport boxes with numerous configuration options. Rondo commissioned Aicomp to create and implement a suitable configuration model for their SAP system.

  • Mayer Group uses automated route determination for cross-plant productions

    Mayer-Kuvert-network is the largest company in the envelope industry in Europe. Across the group, around 16 billion envelopes are produced annually on 136 reel-fed and 59 sheet-fed machines. This grown structure creates high demands on the system landscape – especially for product configuration and calculation and overall, for fast CPQ processes.

  • 30th VCPowerPack Go-Live at Menasha Packaging

    Menasha Packaging has recently gone live with VCPowerPack in its thirtieth facility, including warehouses, since November 2017. Menasha Packaging runs the latest version of VCPowerPack in its plants and warehouses, spanning the United States coast-to-coast from Santa Fe Springs, California to Philadelphia, Pennsylvania.

  • 12th Successful Go-Live at Saica

    On November 18, 2019 Saica manages the next cross-border go-live with Aicomp’s add-on “VCPowerPack” for SAP® ERP, just 4 weeks after the previous successful go-live.

  • Aicomp’s add-on VCPowerPack successfully running at Mondi as Kernel Solution

    Aicomp’s industry solution VCPowerPack “Flexibles” is now successfully running at Mondi, one of the largest global packaging and paper groups. The solution will help Mondi optimize processes and substantially increase customer experience. The implementation at Mondi’s Polish plant in Dopiewo is the fourth VCPowerPack Flexibles installation.

  • Aicomp’s add-on “VCPowerPack” for SAP® ERP successfully running at SAICA

    Aicomp announced today that SAICA Group, one of the largest European packaging manufacturers, recently implemented its industry solution “Packaging,” in two Spanish plants. Aicomp, an SAP partner, developed “Packaging” as part of its ”VCPowerPack” for SAP® ERP. The implementation will help SAICA optimize processes and keep prices competitive.