NGK to Triple Production Capacity for HICERAM Carrier - Strengthening Response to the Next-Generation Semiconductor Market -

NGK INSULATORS, LTD. (hereinafter, “NGK”) will triple its production capacity for the HICERAM Carrier by fiscal 2027 to meet growing demand for chiplet integration, a key technology in advanced fields such as AI and autonomous driving. Through this expansion, the NGK Group aims to establish a stable supply system and achieve net sales of 20 billion yen in the high-performance semiconductor market by fiscal 2030.

With the rapid spread of generative AI, demand for high-performance semiconductors is increasing. The HICERAM Carrier serves as a support wafer*1 used to temporarily hold semiconductor chips during chiplet integration*2, a technology that combines multiple small semiconductor chips to achieve high performance. As such, the HICERAM Carrier is attracting attention as an essential component in the chiplet integration process of semiconductor manufacturing.

The HICERAM Carrier uses HICERAM*3, a translucent ceramic material that NGK has developed and refined over many years. In addition to its light-transmitting properties, this material offers high rigidity and durability, significantly reducing warping and breakage during manufacturing—issues commonly seen with conventional glass support wafers. This improvement enhances process stability for customers and contributes to reduced product loss and improved quality.

As part of this capital investment, NGK will enhance the production facilities of its subsidiary NGK CERAMIC DEVICE CO., LTD. (Komaki City, Aichi Prefecture), which is responsible for manufacturing, while also introducing new forming and firing equipment at NGK ELECTRONICS DEVICES, INC.*4 (Mine City, Yamaguchi Prefecture), which handles the upstream processes. These enhancements will expand the Group’s overall production capacity to approximately three times the current level and establish a stable supply system.

Under its medium- to long-term vision, “NGK Group Vision Road to 2050” looking ahead to 2050, the NGK Group is promoting a transformation of its business portfolio toward the Carbon Neutral (CN) and Digital Society (DS) fields. Toward 2030, a milestone, the Group is pursuing the New Value 1000 initiative, which aims to generate over 100.0 billion yen in net sales from new businesses. The HICERAM Carrier, as a key component supporting the production of next-generation semiconductors, will contribute to the advancement of the digital society.

Going forward, NGK will continue to leverage its proprietary ceramic technologies to help address social challenges in the Carbon Neutral and Digital Society fields.

*1. A substrate used to temporarily hold chips during semiconductor manufacturing processes, ensuring stability during production.

*2. A technology that achieves performance equal to or greater than conventional single chips by densely integrating multiple small chips (chiplets) divided by function. By miniaturizing only the critical functions, manufacturing costs and yield can be optimized.

*3. A ceramic material that combines light-transmitting properties with high rigidity and durability, maintaining stable performance even under high-temperature and high-load conditions.

*4. On April 1, 2026 (planned), the sales division of NGK ELECTRONICS DEVICES, INC. will be succeeded by NGK INSULATORS, LTD. through a company split, while the manufacturing division will be absorbed by NGK CERAMIC DEVICE CO., LTD. through a merger.