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AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
A very uniform layer distribution enables the minimum layer thickness to be achieved at specified measuring points without unnecessary use of gold – even in geometrically complex components such as pin, spring and plug contacts, as well as contact sockets and sleeves.
Dohma48 / Shutterstock
- License:
- Media Use
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- By:
- Dohma48 / Shutterstock
- Copyright:
- Umicore
- File format:
- .jpg
- Size:
- 6000 x 3372, 11 MB
