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  • AdobeStock_48131410.jpeg
    Guangzhou
    License:
    All rights reserved
    File format:
    .jpg
    Copyright:
    Adobe Stock
    Size:
    3000 x 2000, 2.21 MB
  • AdobeStock_97067414.jpeg
    Sao Paulo
    License:
    All rights reserved
    File format:
    .jpg
    Copyright:
    2025
    Size:
    3500 x 2333, 4.42 MB
  • shutterstock_446687797.jpg
    Orlando
    License:
    All rights reserved
    File format:
    .jpg
    Copyright:
    2025
    Size:
    5760 x 3840, 19.9 MB
  • Benjamin Wieser
Division Manager Technical Applications Precious Metals
Business Unit: Umicore Metal Deposition Solution
    Benjamin Wieser (Umicore Electroplating)
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3075 x 2050, 2.13 MB
    Download
  • A comparison of standard electrolytes with the two AURUNA® electrolytes shows an almost identical contact resistance.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 754 KB
    Download
  • Compared to a standard electrolyte, both AURUNA® electrolytes show a significantly lower reaction to high current densities.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 831 KB
    Download
  • Over the past two years, the price of gold has nearly doubled.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 1.1 MB
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  • Conventional hard gold electrolytes tend to deposit more gold in areas close to the anode.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 1.08 MB
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  • An optimally distributed gold layer in the desired thickness is prepared in small-part mass coating.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    1954 x 1475, 2.48 MB
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  • The high-quality coating characteristics of both processes compromise technical properties.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    4000 x 3000, 5.16 MB
    Download
  • A very uniform layer distribution enables the minimum layer thickness to be achieved at specified measuring points.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    6000 x 3372, 11 MB
    Download
  • AURUNA® 526 and AURUNA® 527 enable uniform hard gold plating, thereby optimizing costs.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    10008 x 4429, 2.53 MB
    Download
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