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Hi-Tech Corporation has successfully installed the state-of-the-art Thru-Cup® EVF-YF9 copper plating process.
Hi-Tech Corporation in Macedonia has successfully installed a production line equipped with the state-of-the-art Thru-Cup® EVF-YF9 copper plating process for coating blind vias.

Press release -

Umicore MDS successfully installs the Uyemura Thru-Cup® EVF-YF9 process at Hi-Tech Corporation – a strong signal for Europe's printed circuit board industry

Umicore MDS, the exclusive European distributor for the Japanese plating specialist Uyemura, has successfully installed the advanced Thru-Cup® EVF-YF9 copper process for plating blind vias (blind holes) at the high-tech PCB manufacturer Hi-Tech Corporation in North Macedonia. The project underscores Umicore MDS’s long-standing expertise in implementing and supporting sophisticated Uyemura processes at leading European PCB manufacturers.

Thru-Cup® EVF-YF9 is an electrolytic copper process specifically developed for the reliable plating of blind vias. It offers exceptional process stability, particularly due to the (CVS) analyzability of all additives used, a long service life and enables the simultaneous plating of through-holes (PTH) and blind vias in panel and pattern technology – a decisive advantage for the production of complex HDI printed circuit boards. The process is also REACH-compliant and meets the highest environmental sustainability standards.

Thru-Cup® EVF-YF9 is an advanced additive system for the electrolytic copper plating of printed circuit boards. It is used for panel plating and pattern plating of blind vias, as well as for simultaneous through-hole plating.

“The installation at Hi-Tech, carried out in close collaboration with the process supplier Uyemura and the European equipment manufacturer involved, is an excellent example of successful international cooperation,” explains Andreas Groß, Head of PCB Processes at Umicore MDS. “Especially in times when Europe is losing ground in the field of printed circuit board manufacturing and dependence on Asian markets is growing, such projects are particularly important. They demonstrate how European industry can regain its competitive edge – through the careful selection of reliable project partners and trusting collaboration at all levels.”

Based in Skopje, Hi-Tech Corporation has been a leading manufacturer of complex printed circuit boards for demanding applications in the automotive, telecommunications, medical technology and industrial sectors for over 40 years. Umicore MDS supports its long-standing customer Hi-Tech by providing innovative coating solutions to help ensure its technological leadership in a global competitive environment.

Milan Stankovic, Director of Manufacturing at Hi-Tech, is extremely pleased with how the project has progressed: “The new process delivers consistent, high-quality results with short cycle times. Without the support of Umicore and Uyemura, we would not have achieved these results in such a short time. Their technical expertise was crucial – both in configuring the equipment and in ramping up the process.”

For decades, Umicore MDS has been successfully implementing Uyemura processes at European printed circuit board manufacturers. Technical expertise, a deep understanding of the process and high service standards make the company a reliable partner for sophisticated plating solutions.

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About Umicore Metal Deposition Solutions

Umicore's Business Unit Metal Deposition Solutions (MDS) is part of Umicore Group. The business unit harbors two business lines Electroplating and Thin Film Products. MDS is one of the world's leading suppliers of products for (precious) metal-based coating of surfaces in the nano and micrometer range – with the expertise of the two areas, we combine the two highest-quality processes: electroplating and PVD coatings.

MDS's solutions are used in many products for everyday use, and in some cases their production would not be possible without them. Almost all well-known manufacturers in the electronics, automotive, optics and jewellery industries purchase components that have been coated with our Umicore products, either directly or indirectly.

In addition to development and production, Metal Deposition Solutions offers a comprehensive service for its products. This includes not only advice and technical support on site, but also recycling and precious metal management.

Please activate this link for more information on Metal Deposition Solutions
Please activate this link for more information on Umicore Group


About Hi-Tech Corporation

Hi-Tech Corp. is a European manufacturer of complex printed circuit boards specializing in HDI, rigid-flex, and high-frequency PCBs. The company exports 100% of its production to the EU and the U.S. and offers end-to-end solutions, including assembly and CAM engineering.


Link: Hi-Tech Corporation


About Uyemura

C. Uyemura & Co., Ltd., headquartered in Osaka, Japan, is a leading global provider of electrochemical solutions for the printed circuit board and semiconductor industries. Uyemura’s products are regarded as the benchmark for quality, performance, and environmental sustainability.


Link: Uyemura

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  • Thru-Cup® EVF-YF9 is an advanced additive system for the electrolytic copper plating of printed circuit boards.
    Uyemura Thru-cup EVF-YF9 Process at Hi-Tech Corporation / Umicore Electroplating
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  • Hi-Tech Corporation has successfully installed the state-of-the-art Thru-Cup® EVF-YF9 copper plating process.
    Uyemura Thru-cup EVF-YF9 Process at Hi-Tech Corporation / Umicore Galvanotechnik
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