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  • Thru-Cup® EVF-YF9 is an advanced additive system for the electrolytic copper plating of printed circuit boards.
    Uyemura Thru-cup EVF-YF9 Process at Hi-Tech Corporation / Umicore Electroplating
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    Copyright:
    Shutterstock
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    3669 x 2753, 17.1 MB
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  • Hi-Tech Corporation has successfully installed the state-of-the-art Thru-Cup® EVF-YF9 copper plating process.
    Uyemura Thru-cup EVF-YF9 Process at Hi-Tech Corporation / Umicore Galvanotechnik
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3024 x 4032, 4.27 MB
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  • Rosemont
    License:
    All rights reserved
    File format:
    .jpg
    Copyright:
    2026
    Size:
    3600 x 2400, 10.3 MB
  • A uniform and homogeneous gold-iron layer deposited from AURUNA® 8000 in the FIB cutting.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    2402 x 1800, 1.61 MB
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  • The contact resistance measurement shows consistently low readings across the entire pH value and current density range.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    2408 x 1616, 440 KB
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  • At high current densities, the choice of electrolyte composition has only a minimal effect on the plating speed.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    2404 x 1376, 660 KB
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  • With AURUNA® 8000, Umicore is expanding its sustainable gold-iron portfolio without replacing existing hard gold electrolytes
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3744 x 2496, 1.2 MB
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  • Connectors and electronic contacts benefit from the coating's high wear resistance and thus reliable performance.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    2520 x 1679, 1.54 MB
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  • With AURUNA® 8000, Umicore is expanding its existing range of sustainable gold-iron electrolytes.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    4175 x 2784, 2.03 MB
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  • Karl Hieber (center) with the IHK certificate of honor, surrounded by management, staff representatives and close colleagues.
    Karl Hieber - service anniversary - 25 years / Umicore Electroplating
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    Copyright:
    Umicore
    Size:
    5472 x 3648, 4.11 MB
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  • Umicore Way in Schwaebisch Gmuend
    Umicore Way in Schwaebisch Gmuend
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    All rights reserved
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2363, 4.56 MB
  • AdobeStock_48131410.jpeg
    Guangzhou
    License:
    All rights reserved
    File format:
    .jpg
    Copyright:
    Adobe Stock
    Size:
    3000 x 2000, 2.21 MB
  • AdobeStock_97067414.jpeg
    Sao Paulo
    License:
    All rights reserved
    File format:
    .jpg
    Copyright:
    2025
    Size:
    3500 x 2333, 4.42 MB
  • shutterstock_446687797.jpg
    Orlando
    License:
    All rights reserved
    File format:
    .jpg
    Copyright:
    2025
    Size:
    5760 x 3840, 19.9 MB
  • Benjamin Wieser
Division Manager Technical Applications Precious Metals
Business Unit: Umicore Metal Deposition Solution
    Benjamin Wieser (Umicore Electroplating)
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    Copyright:
    Umicore
    Size:
    3075 x 2050, 2.13 MB
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  • A comparison of standard electrolytes with the two AURUNA® electrolytes shows an almost identical contact resistance.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 754 KB
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  • Compared to a standard electrolyte, both AURUNA® electrolytes show a significantly lower reaction to high current densities.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 831 KB
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  • Over the past two years, the price of gold has nearly doubled.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 1.1 MB
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  • Conventional hard gold electrolytes tend to deposit more gold in areas close to the anode.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 1.08 MB
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  • An optimally distributed gold layer in the desired thickness is prepared in small-part mass coating.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    1954 x 1475, 2.48 MB
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