Topics: New products, services

  • Umicore MDS operates according to a globally standardized approach to processes and quality.
    Electroforming as a Service / Umicore Electroplating
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    Copyright:
    Umicore
    Size:
    5384 x 3589, 4.24 MB
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  • Test samples for electroforming (provided as a service by Umicore MDS) can be produced for project qualification.
    Electroforming as a Service / Umicore Electroplating
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    File format:
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    Copyright:
    Umicore
    Size:
    8024 x 5294, 7.99 MB
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  • Example of an electroformed jewelry component (bangle) . Umicore MDS will offer electroforming as a service in the future.
    Electroforming as a Service / Umicore Electroplating
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    File format:
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    Copyright:
    Umicore
    Size:
    6000 x 3488, 8.62 MB
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  • Hi-Tech Corporation has successfully installed the state-of-the-art Thru-Cup® EVF-YF9 copper plating process.
    Uyemura Thru-cup EVF-YF9 Process at Hi-Tech Corporation / Umicore Electroplating
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    File format:
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    Umicore
    Size:
    3024 x 4032, 4.27 MB
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  • Thru-Cup® EVF-YF9 is an advanced additive system for the electrolytic copper plating of printed circuit boards.
    Uyemura Thru-cup EVF-YF9 Process at Hi-Tech Corporation / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Shutterstock
    Size:
    3669 x 2753, 17.1 MB
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  • A uniform and homogeneous gold-iron layer deposited from AURUNA® 8000 in the FIB cutting.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    2402 x 1800, 1.61 MB
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  • The contact resistance measurement shows consistently low readings across the entire pH value and current density range.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    Umicore
    Size:
    2408 x 1616, 440 KB
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  • At high current densities, the choice of electrolyte composition has only a minimal effect on the plating speed.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    Copyright:
    Umicore
    Size:
    2404 x 1376, 660 KB
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  • With AURUNA® 8000, Umicore is expanding its sustainable gold-iron portfolio without replacing existing hard gold electrolytes
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    File format:
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    Copyright:
    Umicore
    Size:
    3744 x 2496, 1.2 MB
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  • Connectors and electronic contacts benefit from the coating's high wear resistance and thus reliable performance.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    2520 x 1679, 1.54 MB
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  • With AURUNA® 8000, Umicore is expanding its existing range of sustainable gold-iron electrolytes.
    AURUNA 8000 - Sustainable hard gold plating for high-speed systems / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    4175 x 2784, 2.03 MB
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  • Benjamin Wieser Division Manager Technical Applications Precious Metals Business Unit: Umicore Metal Deposition Solution
    Benjamin Wieser (Umicore Electroplating)
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    File format:
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    Copyright:
    Umicore
    Size:
    3075 x 2050, 2.13 MB
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  • A comparison of standard electrolytes with the two AURUNA® electrolytes shows an almost identical contact resistance.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 754 KB
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  • Compared to a standard electrolyte, both AURUNA® electrolytes show a significantly lower reaction to high current densities.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 831 KB
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  • Over the past two years, the price of gold has nearly doubled.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 1.1 MB
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  • Conventional hard gold electrolytes tend to deposit more gold in areas close to the anode.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    3543 x 2362, 1.08 MB
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  • An optimally distributed gold layer in the desired thickness is prepared in small-part mass coating.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    1954 x 1475, 2.48 MB
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  • The high-quality coating characteristics of both processes compromise technical properties.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
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    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    4000 x 3000, 5.16 MB
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  • A very uniform layer distribution enables the minimum layer thickness to be achieved at specified measuring points.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    6000 x 3372, 11 MB
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  • AURUNA® 526 and AURUNA® 527 enable uniform hard gold plating, thereby optimizing costs.
    AURUNA® 526 & 527 - Cost-optimized hard gold plating / Umicore Electroplating
    License:
    Media Use
    File format:
    .jpg
    Copyright:
    Umicore
    Size:
    10008 x 4429, 2.53 MB
    more info...
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