Am 3. April 2025 öffnete das international tätige IT-Unternehmen Aicomp seine Türen für vier Schülerinnen im Rahmen des bundesweiten Girls'Day - Mädchen-Zukunftstags. Das Unternehmen, das sich auf ERP-Lösungen für die Verpackungsindustrie spezialisiert hat, bot den Teilnehmerinnen einen praxisnahen Einblick in die Berufsfelder der Fachinformatik mit Schwerpunkt Anwendungsentwicklung und Systeminte
On April 3, 2025, the international IT company Aicomp opened its doors to four female students as part of the nationwide Girls' Day initiative. The company, which specializes in ERP solutions for the packaging industry, offered the participants practical insights into the professional fields of IT specialization with a focus on application development and system integration.
Promoting Female Ta
In a ground-breaking move that will transform the packaging industry, Aicomp Group announces the expansion of its strategic partnership with Esko, a global provider of integrated software and hardware solutions for the packaging, label and wide format sectors. This collaboration introduces an innovative CAD-ERP integration, leveraging Aicomp’s advanced ERP capabilities with Esko’s state-of-the-art
El evento Aicomp Summit 2024 presenta los últimos avances técnicos y conocimientos en el campo del software para la industria del envasado en presentaciones y talleres profesionalmente desafiantes. El evento híbrido que se celebrará en Berlín los días 14 y 15 de febrero de 2024 ofrece información relevante tanto para fabricantes de envases como para socios de digitalización.
The Aicomp Summit 2024 presents the latest technical developments and insights in the field of software for the packaging industry in presentations and professionally challenging workshops. The hybrid event in Berlin from February 14-15, 2024 offers relevant information for both packaging manufacturers and digitization partners.
Das Aicomp Summit 2024 präsentiert neueste technische Entwicklungen und Erkenntnisse im Bereich Software für die Verpackungsbranche in Vorträgen und fachlich anspruchsvollen Workshops. Das Hybrid-Event in Berlin vom 14. bis zum 15. Februar 2024 bietet relevante Informationen sowohl für Verpackungshersteller als auch für Digitalisierungspartner.
Aicomp und Esko sind eine Partnerschaft eingegangen, um integrierte Lösungen für Verpackungshersteller zwischen der CAD-Suite von Esko und den ERP-Softwarelösungen von Aicomp zu entwickeln. Ziel ist die Entwicklung von Best Practices zur Verbesserung der Design- und Angebotsprozesse. Dieses Interview beleuchtet die Vorteile der Integration.
Aicomp and Esko have formed a partnership to create integrated solutions for packaging manufacturers between Esko´s CAD Suite and Aicomp´s ERP software solutions. The goal is to develop best practices for enhancing the design and quotation processes. This interview highlights the benefits of integration.
Hinojosa, fabricante líder de envases con 13 plantas en España, Francia y Portugal, confía en las soluciones de Aicomp para ayudarles a ser más competitivos acelerando su estrategia de digitalización.
Hinojosa, ein führender Verpackungshersteller mit 13 Werken in Spanien, Frankreich und Portugal, setzt auf die Lösungen von Aicomp, um seine Wettbewerbsfähigkeit durch die Beschleunigung seiner Digitalisierungsstrategie zu steigern.
Hinojosa, a leading packaging manufacturer with 13 plants in Spain, France, and Portugal, relies on solutions from Aicomp to help them become more competitive by accelerating their digitalization strategy.
For nearly 20 years Aicomp has experienced success and growth in the United States, and we’re striving to keep up the momentum! For this reason, Aicomp in the U.S. is adapting its organizational structure to best support growth for years to come.
Aicomp ändert im Zuge der Anpassung ihrer Vorstandsstruktur die bestehende Geschäftsführung in Deutschland und Österreich. Damit wechseln die früheren Standortleiter Jörg Helmreich (Deutschland) und Francesco Reitano (Österreich) nun offiziell in die operative Geschäftsführung.
Aicomp is changing its existing management in Germany and Austria as part of its new board structure. As a result, the former regional general managers Jörg Helmreich (Germany) and Francesco Reitano (Austria) are being promoted to executive management.
Aicomp has been present at its Vienna office for 10 years, successfully supporting its customers in the packaging industry with industry-specific ERP software solutions and extensions. On the occasion of this anniversary, Aicomp invited Austrian customers, prospects and partners to a joint celebration. Among others, representatives of the MM Group, Mondi & Prinzhorn as well as SAP were welcomed.
The Aicomp Summit will present digitalization for the packaging industry – An event created by the Aicomp Group to enable a platform to exchange knowledge for packaging manufacturers and digitalization partners.
For almost 10 years, the Aicomp Group and T.CON GmbH & Co. KG have been working together to implement ERP solution projects for the packaging market. Collectively the two companies are now advancing their successful collaboration through a sales and implementation partnership with the goal of offering an inclusive ERP solution from a single source.
Aicomp and Esko will develop consistently integrated best practice solutions for small and medium-sized packaging manufacturers to automatically calculate prices and determine optimal production routes.
Since September last year, the MC-Box has been produced in St. Ruprecht, at the Styrian site of Rondo Ganahl AG. Modular packaging is a revolutionary concept for heavy goods: it is the first wood-free alternative to classic transport boxes with numerous configuration options. Rondo commissioned Aicomp to create and implement a suitable configuration model for their SAP system.
Mayer-Kuvert-network is the largest company in the envelope industry in Europe. Across the group, around 16 billion envelopes are produced annually on 136 reel-fed and 59 sheet-fed machines. This grown structure creates high demands on the system landscape – especially for product configuration and calculation and overall, for fast CPQ processes.